• School of Materials Science and Engineering

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    WANG Kaikun

    Professor at Department of Materials Processing and Control Engineering


    kkwang@mater.ustb.edu.cn

    +86-010-62333892

    Available to act as adviser for international graduate student: No



    Biography

    Prof. Dr.-Ing Kai-kun WANG got his Bachelor and Master degree in Dept. of Metal Forming at Hefei Univ. of Technology. He did his PhD work in Dept. of Metal Forming at RWTH-Aachen Univ. in Germany. During 2006-2008 he did post-doctor work in Tsinghua Univ. He has put forward many innovative technologies in the area of semi-solid forming, e.g. Thixo-joining, multi-layer tube thixo-co-extrusion, thixo-forming of electronic package shell with composites, flexible-thixo-extrusion, etc.He has published more than 100 scientific papers and got 12 authorized patents in areas of forging, extrusion, stamping with metal alloys and composites. He is now the Chair of Expert Committee of Non-ferrous and Composites Engineering Center of Gansu Province, consulting expert of CIECC, member of semi-solid forming scientific committee in China, member of plastic forming committee in Germany.


    Research Interests

    1.Preparation and Processing of metal alloys and composites, including Aluminum and Magnesium alloys, Composites of SiC/Al and C/Cu,etc. 

    2.Metal forming of alloys and composites, including semi-solid forming, forging, extrusion, rolling, stamping. 

    3.Micro-forming and Numerical Simulation.


    Published Research (English only)

    [1]   Kai-kun Wang. Semi-solid Forging Electronic Packaging Shell with Silicon Carbon Reinforced Copper Composites [J]. Rare Metals. 32(2):191-195,2013.  

    [2]   Kai-kun Wang,Jin-long Fu.A Boubaker Polynomials Expansion Scheme for Solving the Flow of Nonlinear Power-law Fluid in Semi-solid State [J].Solid State Phenomena,Vols.192-193,pp276-280,2013.  

    [3]   Xiao-lei Lv,Kai-kun Wang,Lu Zhou. Investigation On Flexible Thixo-extrusion of Complex Part [J].Solid State Phenomena,Vols.192-193,pp299-304,2013.

    [4]   Kai-kun Wang, Lei Wang, Lu Wang, etc. Unsteady-state Analysis of Temperature Field of Electronic Package with Power Chip. ICEPT-HDP2013, pp439-443, Dalian, 2013.

    [5]   Kai-kun Wang, Zhen-ya Li, Yin Liu. Investigation on Thixo-forging and Electroplating of SiCp/A356 Electronic Packaging Shell. ICTP2011, pp1035-1040, Germany, 2011.

    [6]   Kai-kun Wang. Thixo-forging and Simulation of Complex Parts of Aluminum Alloy AlSi7Mg [J]. International J. of Minerals, Metallurgy and Materials. 17(1):53-57, 2010.

    [7]   Kai-kun Wang, Fu-Yu Wang, Lu Wang,etc. Numerical Simulation on Thixoforging of Electronic Packaging Shell with SiCp/A356 Composites [J]. Trans. Nonferrous Met. Soc. China. Vols.20, pp1707-1711, 2010.

    [8]   Kai-kun Wang, Jian-lin Sun, Yong-lin Kang, etc. Investigation on Inductive Heating of A356 for Thixo-forming [J]. International J. of Minerals, Metallurgy and Materials. Vol16, No.3. 2009. 

    [9] Kai-kun Wang, Peng Zhang, Yan-mei Du, etc. Basic Study on Thixo-co-extrusion of Multi-layer Tube with Al/Mg Alloys. Proc. of the 10th S2p Conference. 2008, Aachen, Germany. Solid State Phenomena. Vols 141-143. P73-78. 

    [10] Kai-kun WANG, Reiner Kopp, Gerhard Hirt. Investigation on Forming Defects and Segregation of Aluminum Alloy AlSi7Mg in Thixo-forging[J]. Advanced Engineering Materials. 8:724-730, 2006. 

    [11] Kai-kun WANG, Reiner Kopp, Gerhard Hirt. Thixo-forging and Thixo-joining of an Integrated Product[J]. Steel Research International. 77(5):341-346, 2006. 


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